Successfully established highly automated production line.
IPO effected on Oct 19th, officially registered pioneer stock board on Oct 31st
.
2022
Accredited by overseas customer with the parts manufacture of Tainan factory
Successfully established HFCVD engineering ability.
Officially acquired revenue from solar power electricity generation system
Achieved NT$98.02 million paid-up capital stock after retiring 198 thousand stock
according to the corporation law, article 167 section 1.
2021
Achieved NT$100 million paid-up capital stock after retiring 15.04 million shares.
2020
Successfully developed thermal sprayed E-chuck.
Inaugurated building-B of the Tainan factory
Set up solar power electricity generation system on the roof of both building A and B.
Achieved NT$250.4 million paid-up capital stock after retiring 420 thousand stock
according to the corporation law, article 167 section 1.
2019
Accredited by ISO 9001:2015 for the Tainan factory.
2018
Ground-breaking building-B construction of the Tainan factory
2016
Successfully developed 200mm 2nd generation heater
Awarded bronze prize of Talent Quality Management System (TTQS), enterprise and
organization version, from Ministry of Labor, Workforce Development Agency.
2015
Accredited by overseas customer with the wet process of Tainan factory
2014
Started the development of 200mm 2nd generation heater.
2012
Merged the production lines of Hsinchu and Tainan factory and closed the Hsinchu
factory.
Achieved NT$254.6 million paid-up capital stock after retiring 1340 thousand stock
according to the corporation law, article 167 section 1.
2011
Closeout the enhancing sustainable research project: Research and development of high
efficiency CdTe thin film solar battery.
2010
Started the development of large-size PECVD and evaporation equipment.
2009
Successfully established vacuumed brazing process.
Successfully established plasma spray process.
Received heater orders from customers
Cooperated with NSYSU Department of Materials and Optoelectronic Science to
execute enhancing sustainable research project from the National Science and Technology
Council: Research and development of high efficiency CdTe thin film solar battery
2008
Successfully established high-energy beam surface process manufacturing.
Successfully developed rotatable cathode applied to large sized glass (2.54x3.66m +)
with PVD coating.
Accredited by ISO 9001:2000 for the Tainan factory.
2003
Gained ISO certificate for the Tainan factory
Held seminar with subcontractors
2002
Inaugurated building-A of the Tainan factory
Closeout the Winbond Electronics Corp. equipment project.
2000
Conducted Technology Development Programs for the industry: Development of the
BGA plasma cleaning technic
Surmounted the large-area high density plasma source technic and applied for patent.
Achieved NT$268 million paid-up capital after conducting cash capital increase.
Executed key element parts and product development plan: Chlorofluorocarbons (CFCs)
exhaust plasma reaction system development.
Closeout the Technology Development Programs for the industry: Development of the
BGA plasma cleaning technic
Ground-breaking of the new factory construction located in Tainan Science Park.
1999
Executed middle-small sized enterprise research projects supported by the business unit
under the Ministry of Economic Affairs: Development of plasma etch equipment’s
electrostatic chuck.
Conducted Hsinchu Science Park’s innovative product developing project: Development
of plasma aid electric resistance heating wafer cassette applied to CVD process
equipment.
Successfully developed BGA Plasma Cleaner
Achieved NT$250 million paid-up capital after conducting cash capital increase.
1998
Successfully developed high density electro-etching cluster tool.
Successfully developed titanium alloy Collimator used on PVD process equipment
Achieved NT$182 million paid-up capital after conducting cash capital increase
1997
Successfully developed anodized aluminum alloy parts, plasma spray coated parts, and
ceramic parts. Actively evolved semiconductor subsystem parts including susceptor,
heater, and e-chuck.
Joint the “12 inches wafer high density plasma source development” industry-academia
collaboration project held by National Tsing Hua University.
Achieved NT$118 million paid-up capital after conducting cash capital increase.
Acquired semiconductor equipment design concept through refurbishing the 8” wafer
manufacture equipment set purchased from Winbond Electronics Corp.
1995
Developed high precision titanium alloy and cobalt alloy artificial hip joint.
Successfully exported to artificial bones companies in the States.
Included semiconductor equipment parts and subsystem parts into business items.
Actively developed parts applied to semiconductor manufacturing equipment.
1994
Established in the Hsinchu Science Park
Manufactured artificial bones and successfully exported to overseas artificial bones
companies
2023
Successfully established highly automated production line.
IPO effected on Oct 19th, officially registered pioneer stock board on Oct 31st
.
2022
Accredited by overseas customer with the parts manufacture of Tainan factory.
Successfully established HFCVD engineering ability
Officially acquired revenue from solar power electricity generation system.
Achieved NT$98.02 million paid-up capital stock after retiring 198 thousand stock
according to the corporation law, article 167 section 1.
2021
Achieved NT$100 million paid-up capital stock after retiring 15.04 million shares
2020
Successfully developed thermal sprayed E-chuck.
Inaugurated building-B of the Tainan factory
Set up solar power electricity generation system on the roof of both building A and B.
Achieved NT$250.4 million paid-up capital stock after retiring 420 thousand stock
according to the corporation law, article 167 section 1.
2019
Accredited by ISO 9001:2015 for the Tainan factory
2018
Ground-breaking building-B construction of the Tainan factory
2016
Successfully developed 200mm 2nd generation heater
Awarded bronze prize of Talent Quality Management System (TTQS), enterprise and
organization version, from Ministry of Labor, Workforce Development Agency.
2015
Accredited by overseas customer with the wet process of Tainan factory.
2014
Started the development of 200mm 2nd generation heater.
2012
Merged the production lines of Hsinchu and Tainan factory and closed the Hsinchu
factory.
Achieved NT$254.6 million paid-up capital stock after retiring 1340 thousand stock
according to the corporation law, article 167 section 1.
2011
Closeout the enhancing sustainable research project: Research and development of high
efficiency CdTe thin film solar battery.
2010
Started the development of large-size PECVD and evaporation equipment.
2009
Successfully established vacuumed brazing process.
Successfully established plasma spray process.
Received heater orders from customers
Cooperated with NSYSU Department of Materials and Optoelectronic Science to
execute enhancing sustainable research project from the National Science and Technology
Council: Research and development of high efficiency CdTe thin film solar battery.
2008
Successfully established high-energy beam surface process manufacturing.
Successfully developed rotatable cathode applied to large sized glass (2.54x3.66m +)
with PVD coating.
Accredited by ISO 9001:2000 for the Tainan factory.
2003
Gained ISO certificate for the Tainan factory.
Held seminar with subcontractors.
2002
Inaugurated building-A of the Tainan factory
Closeout the Winbond Electronics Corp. equipment project.
2000
Conducted Technology Development Programs for the industry: Development of the
BGA plasma cleaning technic
Surmounted the large-area high density plasma source technic and applied for patent.
Achieved NT$268 million paid-up capital after conducting cash capital increase.
Executed key element parts and product development plan: Chlorofluorocarbons (CFCs)
exhaust plasma reaction system development.
Closeout the Technology Development Programs for the industry: Development of the
BGA plasma cleaning technic
Ground-breaking of the new factory construction located in Tainan Science Park.
1999
Executed middle-small sized enterprise research projects supported by the business unit
under the Ministry of Economic Affairs: Development of plasma etch equipment’s
electrostatic chuck.
Conducted Hsinchu Science Park’s innovative product developing project: Development
of plasma aid electric resistance heating wafer cassette applied to CVD process
equipment.
Successfully developed BGA Plasma Cleaner
Achieved NT$250 million paid-up capital after conducting cash capital increase.
1998
Successfully developed high density electro-etching cluster tool.
Successfully developed titanium alloy Collimator used on PVD process equipment
Achieved NT$182 million paid-up capital after conducting cash capital increase.
1997
Successfully developed anodized aluminum alloy parts, plasma spray coated parts, and
ceramic parts. Actively evolved semiconductor subsystem parts including susceptor,
heater, and e-chuck.
Joint the “12 inches wafer high density plasma source development” industry-academia
collaboration project held by National Tsing Hua University.
Achieved NT$118 million paid-up capital after conducting cash capital increase.
Acquired semiconductor equipment design concept through refurbishing the 8” wafer
manufacture equipment set purchased from Winbond Electronics Corp.
1995
Developed high precision titanium alloy and cobalt alloy artificial hip joint.
Successfully exported to artificial bones companies in the States.
Included semiconductor equipment parts and subsystem parts into business items.
Actively developed parts applied to semiconductor manufacturing equipment.
1994
Established in the Hsinchu Science Park
Manufactured artificial bones and successfully exported to overseas artificial bones
companies.
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